Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies.
In order to keep up with the rapid development of manufacturing need and for quick and easy set-up, die attach equipment are usually equipped with adaptor heads that allow quick replacement of dispensing nozzle tips.
We provide kinds of dispensing nozzle with different specifications for all types of die bonders in the market including Besi (Esec 2100), ASM AD8312 Plus and HITACHI DB series, Musashi Dispensers, Camelot Dispensers and Nordson ASYMTEK Fluid Dispensers, etc…
The offering includes writing pen, fluid dispensing nozzle, high-precision ceramic nozzle tip, multi-needle dispensing nozzles and jet nozzles.
HITACHI dispensing system (Seal machine)
Integrated design, hardness is much higher than SUS, excellent concentricity and durability, custom ID and OD