Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection.
To ensure the glue flows smoothly, our dispensing nozzles dealt with a high precision processing method have features of integrated design and mirror grade inner surface finish to achieve a superior dispensing performance.
We provide kinds of dispensing nozzle with different specifications for all types of die bonders in the market including Besi (Esec 2100), ASM AD8312 Plus and HITACHI DB series, Musashi Dispensers, Camelot Dispensers and Nordson ASYMTEK Fluid Dispensers, etc…
The offering includes writing pen, fluid dispensing nozzle, high-precision ceramic nozzle tip, multi-needle dispensing nozzles and jet nozzles.
Nickel Alloy +Stainless steel thread
Besi (Esec 2100), ASM AD8312 Plus
Hardness is much higher than SUS, excellent concentricity and durability, mirror-grade inner surface, custom ID and OD