High precision dispensing nozzle is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection.
To ensure the glue flows smoothly, our dispensing nozzles dealt with a high precision processing method have features of integrated design and mirror grade inner surface finish to achieve a superior dispensing performance.
We provide kinds of dispensing nozzle with different specifications for all types of die bonders in the market; the offering includes writing pen, fluid dispensing nozzle, high-precision ceramic nozzle tip, multi-needle dispensing nozzles and jet nozzles.
Ceramic +Stainless steel
Ultra-thinned nozzle tip, ultra-fine drawing, two pieces design with nickel alloy tip, mirror-grade inner surface, excellent concentricity and durability, custom ID and OD