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Vimic offers a selection of Die Bonding Tools based on our leading technique.

The offering includes Epoxy Stamping Tools, Die Pick-up Tools and Push-up Needles with designs and features optimized for your bonding needs.

In back-end semiconductor, die attach process is a critical step of attaching a die/chip to a substrate or package.

Most common die bonding methods such as adhesive bonding (epoxy die attach), micron-level pick-and-place and flip chip processes by using our die bonding tools.

As one of the leaders in high precision tools, Vimic is committed to providing the highest quality products & services and a focus on continuous improvement to our customized products and flexible solutions.

Epoxy Stamping Tools Epoxy Stamping Tools Pick-up Tools Pick-up Tools
Push-up Needles Push-up Needles
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