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DIE BONDING TOOLS
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The offering includes Epoxy Stamping Tools, Die Pick-up Tools and Push-up Needles with designs and features optimized for your bonding needs.
In back-end semiconductor, die attach process is a critical step of attaching a die/chip to a substrate or package.
Most common die bonding methods such as adhesive bonding (epoxy die attach), micron-level pick-and-place and flip chip processes by using our die bonding tools.
As one of the leaders in high precision tools, Vimic is committed to providing the highest quality products & services and a focus on continuous improvement to our customized products and flexible solutions.
.Epoxy Stamping Tools | ![]() |
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Pick-up Tools. | |
.Push-up Needles | ![]() |
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SP02-TU
Single Pin Adhesive Stamping Tool

SP02-TU2
Double Pin Epoxy Stamping Tool

SP02-TUS
Epoxy Stamping Tool (Custom-made)

VNEC-01
NEC Metallic pick up tool

SP02-TU4
Four Pin Epoxy Stamping Tool

VNEC-02
NEC Rectangular pick up tool

SP02-TU9
Epoxy Stamping Tool (Multi-pin/ Grid)

VASM-T/ VASM-TU
Pick-up Tool

SP02-TU12
Adhesive Stamping Tool (Multi-tip/ Grid)

VASM-T/ VASM-TU
Pick-up Tool (Bottle Neck Design)

SP02-TU16
Adhesive Stamping Tool (Multi-pin/ Grid)

VASM
Die Pick-up Tool

SP02-TU36
Epoxy Stamping Tool (Multi-pin/ Grid)

VASM-C
Ceramic Pick-up Tool

SP011-TUS
Adhesive Stamping Tool (Custom-made)

VASM-NR
Rubber Tip

SP011-TU12
Adhesive Stamping Tool (Custom-made)

VASM-RU
Vespel Pick-up Tool

VN-C
Pick up Tool for Packaging

CL01
LD Pick up Tool

CL15-C
Ceramic Die Collet

CL16
Die Collet

CL17-TU
Die Collet

SP07-TU
Epoxy Stamping Tool (Multi-tip)

VPN-TU4
Crown Push-up Needle
