About Us

Welcome to Vimic Electronic Corp.

Vimic Electronic Corporation was founded in 2002, first started a R&D center in Tokyo Japan, developed core technologies consist of nickel alloy materials technology, functional design that integrates materials technology to achieve more advanced semiconductor back-end tools and stable production of high quality equipment components.


Vimic manufactures a great range of die bonding tools and high quality equipment components for semiconductor industries from the front of line to the end of line.
  • IC Packaging Carrier
  • NH09- Fluid Dispense Nozzle
  • Equipment Components
  • NH03-Precision Nozzle
  • NH15-Jet Dispensing Nozzle
Products Category

Precision tool design and manufacturing services, we focus on engineering innovative and practical solution, provide the highest of standards and recognized as a leading manufacturer for semiconductor industry.

Company Strengths
Research & DevelopmentDesign & manufacturing flexibility
Quality AssuranceHigh quality of products & services
Short-lead timesEfficiency and effectiveness in supply chain