About Us

Welcome to Vimic Electronic Corp.

Vimic Electronic Corporation was founded in 2002, first started a R&D center in Tokyo Japan, developed core technologies consist of nickel alloy materials technology, functional design that integrates materials technology to achieve more advanced semiconductor back-end tools and stable production of high quality equipment components.


Products Category

Precision tool design and manufacturing services, we focus on engineering innovative and practical solution, provide the highest of standards and recognized as a leading manufacturer for semiconductor industry.

Vimic manufactures a great range of die bonding tools and high quality equipment components for semiconductor industries from the front of line to the end of line.
  • NH09- Fluid Dispense Nozzle
  • NH15-Jet Dispensing Nozzle
  • Equipment Components
  • IC Packaging Carrier
  • NH03-Precision Nozzle
Company Strengths
Research & DevelopmentDesign & manufacturing flexibility
Quality AssuranceHigh quality of products & services
Short-lead timesEfficiency and effectiveness in supply chain