IC Packaging Carrier

IC Packaging Carrier is a high-volume process semiconductor tool for the production of ultra-thin, small footprint, high performance semiconductor packaging.

The process and products manufactured with this carrier have passed the tests to provide the best in performance and reliability to our customers.

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  • Product Features

High temperature resistance
As for its high operating temperature, the carrier used strong metal material with heat resistant coating.

The flatness requirement 0.2mm
Our product specifies the evenness of a surface and accurately flat a plane should be.

Micro locating holes
High precision locating holes technology produce small, complex features at micron level tolerances, without heat effects or material damage.

Customized to your specifications
Provide us an engineering drawing depicts all information and requirements needed, the drawing to help prevent confusion in production.